Publications
Henderson, R., Kamgaing, T., Design of RF Filters in a Silicon BiCMOS Process Using Integrated Passive Components, 2003 Radio Architecture and Circuits Symposium, May 21, 2003, Motorola Internal. 2003 - Publication
Henderson, R., RF Circuit Design Using HDI-EP Scalable Models, 2003 Level 0 Technical Conference, July 30, 2003, Motorola Internal. 2003 - Publication
Tavernier, C., Henderson, R., Papapolymerou, J., A Reduced-Size Silicon Micromachined High-Q Resonator at 5.7 GHz, IEEE Transactions on Microwave Theory and Techniques, Vol. 50, No. 10, pp. 2305-2314, October 2002. 2002 - Publication
Henderson, R.M. and Katehi, L.P.B., Silicon Based On-Wafer and Discrete Packaging, Invited Paper, Directions for Next Generation of MMIC Devices and Systems, Plenum Publishing Corporation, New York, 1997, pp. 113-120. 2002 - Publication
Henderson, R., et. al., Tantalum Nitride Thin Film Resistors for Integration into Copper Metallization Based RF-CMOS and BiCMOS Technology Platforms, 2001 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, pp. 71-74. 2001 - Publication
Weller, T.M., Henderson, R.M., et. al., Three-Dimensional High-Frequency Distribution Networks I: Optimization of CPW Discontinuities, IEEE Transactions on Microwave Theory and Techniques, Vol. 48, No. 10, pp. 1635-1642, October 2000. 2000 - Publication
Drayton, R.F., Henderson, R.M., Katehi, L.P.B., Monolithic Packaging Concepts for High Isolation in Circuits and Antennas, IBM Journal of Research and Development, Vol. 44, No. 5, pp. 715-724, September 2000. 2000 - Publication
Henderson, R.M., et. al., Three-Dimensional High-Frequency Distribution Networks II: Packaging and Integration, IEEE Transactions on Microwave Theory and Techniques, Vol. 48, No. 10, pp. 1643-1651, October 2000. 2000 - Publication
Henderson, R.M. and Katehi, L.P.B., Silicon-Based Micromachined Packages for High Frequency Applications, IEEE Transactions on Microwave Theory and Techniques, Vol. 47, No. 8, pp. 1563-1569, August 1999. 1999 - Publication
Drayton, R.F., Henderson, R.M., Katehi, L.P.B., Monolithic Packaging Concepts for High Isolation in Circuits and Antennas, IEEE Transactions on Microwave Theory and Techniques, Vol. 46, No. 7, pp. 900-906, July 1998. 1998 - Publication